reflow
美 ['ri:fləʊ]英 ['ri:fləʊ]
- n.软熔焊接；页面重排（调整文本在计算机屏幕上的显示密度）
- v.倒流；逆流
- 网络回流；回流焊；回焊
reflowreflow
回流
回流(REFLOW) (1)依据Design Rule，评估设计资料之可制造 性。 (1)PCB---LOAD/UNLOAD 自动搬送。
回流焊
而回流焊(Reflow)又是表面黏着技术中最重要的技术之一。这里我们试着来解释一下回流焊的一些技术与设定问题。
回焊
而回焊(reflow)后的锡球会突出模具表面10-20mm，其高度依锡球尺寸与空腔而定。由图二中可以注意到锡球并不会一致性地在 …
回焊炉
然后过回焊炉(reflow)进行锡膏回流焊,将LED与PCB置件进行连接导通并焊死以上过程后,得出的产品叫LED组,通称LB,即LED BA…
逆流
未分类 - - Nicolas’ Blog - Upholstery ... reflection 反射 reflow v. 回流，逆流 reformat 重新格式化 ...
重熔
此 行高重熔(Reflow)，其所吸藏的有物即形成泡，而被逼出 合金之外，形成一些火山口(Craters)的情形，在表面呈砂高低 不平 …
热风回焊炉
热风回焊炉(Reflow) 10 2.11.1. 操作方法及程式 10 2.11.2. 热风回流区温度设定参考值 10 2.11.3. 热风回焊温度曲线图(PROFIL…
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applicable to different grades of welding equipment requirements, the performance of a wide reflow furnace good welding performance.
可适用不同档次的焊接设备要求，在较宽的回流焊炉内表现良好的焊接性能。
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If these types of defects are caught pre-reflow, the component can be reused in most cases, while post-reflow it must be scrapped .
如果再流前发现这类缺陷，多数情况下这类元器件还能使用，而再流后发现，这类元器件就必须替换。
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Solder Balling is recognized by numerous tiny solder balls trapped along the peripheral edge of the flux residue after reflow.
产品回焊后在残留的助焊剂周边会有大量小的锡球。
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Kester proudly announces that it has been awarded a patent for its Reflow Encapsulant technology including material and method of use.
凯斯特骄傲地宣布，它已获得回流密封剂技术（其中包括材料和使用方法）的专利。
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The extending portion is electrically connected by being reflow soldered to a land at a reverse surface of the substrate.
所述延伸部通过回流焊接与在基板背面的接合部电连接。
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Exceptionally long printing service, and the residues after reflow appear to be transparent.
印刷寿命特长，回流后残留物呈透明状。
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The mechanism of no-reflow phenomenon, the progress in various therapies of improving microcirculation, and existent problems are reviewed.
现对无复流现象的机制及各种改善心肌微循环治疗的研究进展及存在问题作一综述。
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Tombstone phenomenon results from unbalance of solder surface tension on two pads of component soldering terminal during reflow soldering.
“竖碑”现象是元件两端焊盘上的焊膏在回流熔化时对元件两个焊接端的表面张力不平衡所致。
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and allowing the chip and the substrate to pass through a reflow furnace together so that the chip and the substrate are closely combined.
及将所述芯片与所述基板共同过回焊炉，从而使二者紧密结合。
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Lower density of molten Improve gas vent Enlarged or disappear resin due to poor metering after reflow. stability.
密度偏低。回流焊后气泡增大或消失。
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Control can resize or reflow its child controls as the dimensions of the parent form change .
控件可以调整其子控件的大小和流动。
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A general profile setting up a wave solder machine to optimize reflow using an alcohol base flux.
一种常规温度特性曲线，用于对波焊机进行设置，对采用以酒精为基本成分的焊剂回流进行优化。
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What other issues can be expected with the conversion to lead-free reflow soldering?
转变到无铅回流焊接还会遇到什么问题？
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The three different solder pads may each require a slightly different temperature for a simultaneous reflow.
三种不同的焊盘可能需要为同时回流温度略有不同。
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The article reviews progress in research into pathogenesis, diagnosis of coronary no-reflow phenomenon.
现对无再流现象的发病机制及诊断的研究进展进行综述。
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The progresses and the existent problems in prevention and treatment of coronary no-reflow phenomenon following PCI are reviewed.
本文主要对PCI后无再流现象的预防和治疗进展及存在问题进行综述。
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In the end, PLC and temperature sensors are used to complete the reflow soldering temperature control and detection.
采用PLC和温度传感器完成对回流焊温度的现场检测和控制，达到了工艺要求。
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Voluntary voiding function, maximum reflow rate and residual urine volume were used as observation indices.
观察指标为自主排尿能力、最大尿流率和残余尿。
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The product has good heat durability that withstands lead-free compatible reflow soldering conditions.
符合无铅化回流焊接条件，具有耐高温性。
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Conclusions: Intracoronary administration of tirofiban is effective and safe for ACS patients with no reflow phenomenon after PCI.
结论：冠状动脉内注射国产盐酸替罗非班治疗ACS介入术后无复流患者是有效和安全的。
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Lead- free wave soldering, wave soldering wave peak welding machines, reflow soldering machine .
无铅波峰焊，波波峰焊，峰焊接机，回流焊接机。
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Does the product Temperature Profile meet the reflow requirements for the SMT components according to the component manufactures?
产品的温度曲线是否符合零件制造商提供的SMT零件回流焊要求？。
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During subsequent reflow the solder pulls back onto the wettable pad surface to form a solid solder bump structure.
在下一个回流工序，锡膏浸润焊盘表面，形成一个固态锡膏凸起。
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Prevent disease form changing: prevent qi-collateral and blood-collateral, prevent non-reflow after treatment and reoccur after recovery.
既病防变：防止气络及血络、防止治疗后无复流、愈后复发。
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Will the higher temperatures needed for melting lead-free solder create more fumes and condensate in the reflow oven?
熔化无铅焊料所需的高温是否会在回流炉中产生较多的烟雾和冷凝物？
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Voiding behavior of QFN is similar to typical SMT voiding and increases with pad oxidation and further reflow.
QFN排尿行为类似于典型SMT排尿和随焊垫和进一步氧化。
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This process is known as a reflow.
这个过程被称作重排版。
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Good reliability with IR-reflow soldering compared to wave soldering for through hole devices.
与插件器件相比，使用红外回流焊具有更好的可靠性与插件器件相比，
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Surface Mount Component Reflow repair on various substrate materials.
表面贴装元件回流可修复不同衬底材料。
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As mentioned earlier, a reflow is needed whenever layout and geometry change. This happens when.
正如前面所提到的，当布局和几何改变时需要重排版。在下述情况中会发生重排版。