flip-chip
美英
- na.【计】叩焊
- 网络芯片反转；覆晶；倒装芯片
flip-chipflip-chip
芯片反转
计算机语言_互动百科 ... EmbeddedChips（ 嵌入式） flip-chip（ 芯片反转） InstructionColoring（ 指令分类） ...
覆晶
在覆晶(Flip-Chip)焊接过程中，锡球和化镍金界面间产生的界金属生成物(IMC)会强烈影响著锡球接点的可靠度，经分析结果指 …
倒装芯片
倒装芯片(FLIP-CHIP)：FlxIO在die晶粒的核心实现优化的IO；焊线（wire bond：Pad-on-I/O可实现更高的IO密度，降低die晶粒 …
覆晶封装
覆晶封装(Flip-Chip) 在第一层封装上，IC与基板间以直接连接取代打线接合(wire bonding)方式，属於DCA(Direct Chip Attach) …
倒装片
倒装片（fliP－chip）按芯片的电气连接方式来分有引线键合方式无引线键合方式——倒装片键合——TAB（自动键合带）—— …
倒装焊芯片
倒装焊芯片(Flip-Chip)是什么意思 是什么意思 倒装焊芯片 作者：佚名 来源：www.elecfans.com 发布时间：2010-3-4 14:08:08 …
1
The system can process wafers up to 200mm in diameter and includes die inversion for flip chip applications.
该系统可以处理直径多达200毫米的晶片，包括模具的倒装。
2
As an electric current passes through, the Joule heating and electromigration effects occur in the flip chip solder bumps.
当电流通过焊点时，会伴随产生焦耳热效应和电迁移效应。
3
Tow methods, flip-chip method and influence matrix method, were proposed to calculate the suspender tension in a spatial tied-arch bridge.
针对空间系杆拱桥吊杆张拉控制问题提出倒装法和影响矩阵法两种计算方法。
4
The function of voice coil motor in the flip chip process is to complete three movements: pick, orient and place.
音圈电机在贴片流程中主要完成拾片、旋转及放置三个动作。
5
Finally, the application prospects of microwave flip-chip bonding technology is suggested and discussed.
随着应用频率的提高，微波芯片与基板间的互连更多地采用了倒装焊。
6
Firstly, the process of the flip chip which used in RFID tags package is briefly introduced.
首先从封装设备的贴片模块入手，对其贴片工艺流程做了简单介绍。
7
The current crowding effect and temperature distributions in flip chip solders are discussed.
本研究亦讨论在覆晶焊点中之电流聚集效应及其温度分布。
8
With higher current and smaller size trends, electromigration in flip-chip solder has become an critical of reliability concern.
伴随积体电路高电流､小尺寸的设计变化，覆晶焊锡接点内的电迁移现象成为元件可靠度的影响关键。
9
Discuss the necessary of flip chip underfill to ther mal fatigue failures. Put forward controlling parameter for flip chip underfill .
从热疲劳故障的角度论述了倒装芯片底部填充的必要性，介绍了倒装芯片底部填充的参数控制。
10
The dynamics of ultrasonic transducer for thermosonic flip chip bonding is investigated.
研究了热超声倒装键合设备的核心执行机构——换能系统的动力学特性。
11
The most potential low cost flip chip bumping method.
最具前景的低成本倒装焊凸点制备方法
12
A summary of developmental work done in the field of single pass high reliability Flip Chip Reflow Encapsulants .
关于单遍高可靠性倒装片回流密封剂领域研发工作成就的综述。
13
Current Challenges in Traditional Design Verification and its Application in Flip-Chip Devices
传统设计验证及其在倒装芯片应用中所面临的挑战
14
The influence of underfill and its material models on the reliability of flip chip package under thermal cycling
底充胶及其材料模型对倒装焊热循环可靠性的影响
15
Solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages
集成电路倒装芯片封装中半导体芯片及载体之间形成可靠联接所用焊料中的铅。
16
The Failure Study of Interface Delamination in Flip-chip Micro-electron Packaging
倒装焊微电子封装中填料分层开裂失效研究
17
Thermal conductivity prediction of underfill and its affects on the flip chip temperature field
底充胶导热系数预测及对倒装焊温度场的影响
18
flip chip bonding technology used in modern micro - photoelectron package
现代微光电子封装中的倒装焊技术
19
The Probabilistic Designing of the Parameters of Flip Chip Microelectronic Package
倒装焊微电子封装结构参数的概率设计
20
Flip-chip interconnect technology in optoelectronics device packaging
倒装芯片互连技术在光电子器件封装中的应用
21
The Numerical Value Simulation Studying of Flip-Chip Thermal Stress Under Temperature Impulsion
温度冲击下倒装芯片的热应力数值模拟研究
22
Influence of Cure-residual Stress on Underfill Epoxy Reliability in Flip-Chip Assembly Under Thermal Cycling
固化残余应力对倒装焊底充胶可靠性的影响
23
Flip Chip Assembly Hybrid Optoelectronic Integrated RCE Photo-detector Arrays
倒装焊组装的光电混合集成RCE探测器面阵
24
Affects of Low Thermal Expansion Coefficient under fill on Reliability of Flip Chip Solder Joint
低膨胀系数底充胶对倒装焊焊点疲劳可靠性的影响
25
Current Research on the Reaction between Solder Bump and under Bump Metallurgy Systems in Flip Chip
倒装芯片中凸点与凸点下金属层反应的研究现状
26
Electroplating Solder Bumping Flip Chip Technology
电镀焊球凸点倒装焊技术
27
Materials and Metallization Considerations for Flip Chip
倒装焊凸点材料及焊盘金属化
28
Semiconductor Design Standard for Flip Chip Applications
倒装芯片用半导体设计标准
29
Research on Flip-chip Bonding Techniques for Hybrid Focal Plane Array Applications
混成式焦平面阵列芯片倒装互连技术研究
30
Flip chip technology on electronics manufacturing
电子制造中的倒装焊接技术